FUTURE DATA CENTERS: LIQUID IMMERSION COOLING INNOVATION TO WITHSTAND AI HEAT

Aom Thai (1), Pong Krit (2), Siri Lek (3)
(1) Srinakharinwirot University, Thailand,
(2) Rangsit University, Thailand,
(3) Silpakorn University, Thailand

Abstract

The exponential escalation of computational density required by modern Artificial Intelligence (AI) and Large Language Models has pushed traditional air-cooled data center infrastructures to their thermodynamic limits. This study investigates the efficacy of single-phase liquid immersion cooling as a transformative solution to manage the extreme thermal flux of next-generation AI accelerators. Adopting a quantitative experimental design, we benchmarked a high-density GPU cluster submerged in a proprietary dielectric fluid against a standard forced-air baseline under intensive MLPerf training workloads. The research focused on evaluating key performance indicators, including Power Usage Effectiveness (PUE), processor junction temperatures, and total energy consumption over a 168-hour stress test. Results demonstrate that the immersion architecture achieved a near-ideal PUE of 1.04, representing a 34% efficiency improvement over the air-cooled control group. Furthermore, the liquid medium maintained GPU core temperatures 20°C lower than the baseline, effectively eliminating thermal throttling events and enhancing computational stability. The study concludes that shifting from aerodynamic to hydrodynamic cooling is not merely an efficiency upgrade but a physical prerequisite for the sustainable scaling of exascale AI infrastructure, offering a viable pathway to decarbonize the expanding digital economy.

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Authors

Aom Thai
aomthaii@gmail.com (Primary Contact)
Pong Krit
Siri Lek
Thai, A., Krit, P., & Lek, S. . (2025). FUTURE DATA CENTERS: LIQUID IMMERSION COOLING INNOVATION TO WITHSTAND AI HEAT. Journal of Computer Science Advancements, 3(4), 220–234. https://doi.org/10.70177/jsca.v3i4.3333

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